ap16n50i-hf advanced power n-channel enhancement mode electronics corp. power mosfet low on-resistance bv dss 500v simple drive requirement r ds(on) 0.4 fast switching characteristic i d 3 16a rohs compliant & halogen-free description absolute maximum ratings@t j =25 o c(unless otherwise specified) symbol units v ds v v gs v i d @t c =25 drain current, v gs @ 10v 3 a i d @t c =100 drain current, v gs @ 10v 3 a i dm a p d @t c =25 w w/ t stg t j symbol value units rthj-c maximum thermal resistance, junction-case 2.4 /w rthj-a maximum thermal resistance, junction-ambient 65 /w data and specifications subject to change without notice 201501124 thermal data parameter storage temperature range 1 total power dissipation 52 -55 to 150 operating junction temperature range -55 to 150 linear derating factor 0.42 11 pulsed drain current 1 60 gate-source voltage + 20 16 parameter rating drain-source voltage 500 halogen-free product g d s g d s to-220cfm(i) a p16n50 series are from advanced power innovated design and silicon process technology to achieve the lowest possible on- resistance and fast switching performance. it provides the designe r with an extreme efficient device for use in a wide range of powe r applications. the to-220cfm package is widely preferred for all commercial- industrial through hole applications. the mold compound provides a high isolation voltage capability and low thermal resistance between the tab and the external heat-sink.
electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =1ma 500 - - v r ds(on) static drain-source on-resistance 2 v gs =10v, i d =6.5a - - 0.4 v gs(th) gate threshold voltage v ds =v gs , i d =250ua 2 - 4 v g fs forward transconductance v ds =10v, i d =8a - 8 - s i dss drain-source leakage current v ds =500v, v gs =0v - - 25 ua i gss gate-source leakage v gs =+ 20v - - + 100 na q g total gate charge 2 i d =16a - 33 53 nc q gs gate-source charge v ds =400v - 11 - nc q gd gate-drain ("miller") charge v gs =10v - 9 - nc t d(on) turn-on delay time 2 v dd =200v - 55 - ns t r rise time i d =8a - 50 - ns t d(off) turn-off delay time r g =50 - 141 - ns t f fall time v gs =10v - 40 - ns c iss input capacitance v gs =0v - 1950 3120 pf c oss output capacitance v ds =15v - 630 - pf c rss reverse transfer capacitance f=1.0mhz - 20 - pf source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =16a, v gs =0v - - 1.3 v t rr reverse recovery time 2 i s =16a, v gs =0v - 495 - ns q rr reverse recovery charge di/dt=100a/s - 10 - uc notes: 1.pulse width limited by max junction temperature. 2.pulse test this product is sensitive to electrostatic discharge, please handle with caution. use of this product as a critical component in life support or other similar systems is not authorized. apec does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. apec reserves the right to make changes without further notice to any products herein to improve reliability, function or design. 2 3.ensure that the junction temperature does not exceed t jmax. . ap16n50i-hf
ap16n50i-hf fig 1. typical output characteristics fig 2. typical output characteristics fig 3. normalized bv dss v.s. junction fig 4. normalized on-resistance temperature v.s. junction temperature fig 5. forward characteristic of fig 6. gate threshold voltage v.s. reverse diode junction temperature 3 0.4 0.8 1.2 1.6 2.0 2.4 2.8 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d =6.5a v g =10v 0 2 4 6 8 10 0 0.2 0.4 0.6 0.8 1 1.2 v sd , source-to-drain voltage (v) i s (a) t j =25 o c t j =150 o c 0.5 0.7 0.9 1.1 1.3 1.5 -50 0 50 100 150 t j , junction temperature ( o c ) normalized v gs(th) 0.8 0.9 1 1.1 1.2 -50 0 50 100 150 t j , junction temperature ( o c) normalized bv dss 0 10 20 30 0.0 4.0 8.0 12.0 16.0 20.0 v ds , drain-to-source voltage (v) i d , drain current (a) t c =25 o c 16v 12v 10v 7.0v v g =6.0v 0 4 8 12 16 0.0 4.0 8.0 12.0 16.0 20.0 v ds , drain-to-source voltage (v) i d , drain current (a) t c =150 o c 16v 12v 10v 7.0v v g =6.0v
ap16n50i-hf fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. switching time waveform fig 12. gate charge waveform 4 0 0 1 10 100 1000 0.1 1 10 100 1000 v ds ,drain-to-source voltage (v) i d (a) t c =25 o c s in g le puls e 100us 1ms 10ms 100ms 1s dc 0.001 0.01 0.1 1 0.00001 0.0001 0.001 0.01 0.1 1 10 t , pulse width (s) normalized thermal response (r thjc ) p dm duty factor = t/t peak t j = p dm x r thjc + t c t t 0.02 0.01 0.05 0.1 0.2 duty factor = 0.5 single pulse 0 2 4 6 8 10 12 0 10203040 q g , total gate charge (nc) v gs , gate to source voltage (v) i d =16a v ds =400v 1 10 100 1000 10000 1 5 9 1317212529 v ds ,drain-to-source voltage (v) c (pf) f=1.0mhz c iss c oss c rss q v g 10v q gs q gd q g charge t d(on) t r t d(off) t f v ds v gs 10% 90%
ap16n50i-hf marking information 5 part numbe r package code date code (ywwsss) y last digit of the year ww week sss sequence 16n50i ywwsss
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